First issue, Vol. 1, No. 1 (January–June 2026), will be published in April 2026.
The Article Processing Charge (APC) is waived for submissions until 31 May 2026.
Aim of JECIS
The journal aims to provide a rigorous, peer-reviewed international forum for cutting-edge research in electronics, communications, and intelligent systems, encouraging high-quality original research, technical developments, and innovative applications that integrate electronic and communication engineering with intelligent systems. It fosters interdisciplinary collaboration among electrical and electronic engineers, computer scientists, communication engineers, and system designers, supporting the translation of theoretical advances into practical, real-world technologies, from smart devices to communication networks and intelligent control systems. The journal disseminates novel ideas, design techniques, system architectures, and implementation studies that advance electronics and intelligent system engineering, upholding strong ethical, methodological, and publication standards to promote reproducibility, clarity, and academic integrity. By serving both academic researchers and industry practitioners, bridging research with application, and fostering technology transfer, it contributes to global technological progress through the publication of robust, scalable, and impactful work that shapes the future of electronics, communications, and intelligent systems.
Scope of JECIS
JECIS welcomes submissions in (but not limited to) the following broad subject areas:
1. Electronic circuit design, analog/digital electronics, VLSI, and microelectronics systems.
2. Embedded systems, microcontroller/microprocessor‑based design, and real‑time system implementations.
3. Signal processing — digital signal processing (DSP), image/speech/signal filtering, compression, coding, and analysis.
4. Communication systems — wireless, wired, optical communications, RF/microwave engineering, satellite, 5G/6G, and communication protocols.
5. Internet of Things (IoT), sensor networks, wireless sensor networks (WSN), and sensor/actuator-based intelligent systems.
6. Intelligent control systems, automation, robotics, and embedded intelligent devices.
7. Cyber‑physical systems (CPS), smart devices, smart home/industry systems, and integration of hardware with intelligent software.
8. Wireless communication networks, network design, network optimization, network security, and performance evaluation.
9. Signal & data analytics, machine‑learning-assisted signal processing, AI in communication and electronics systems.
10. Real‑time systems, embedded operating systems, firmware, hardware‑software co‑design, and system‑on-chip (SoC) implementations.
11. Smart manufacturing, Industry 4.0 applications, automation systems, and intelligent industrial electronics and communication.
12. Control theory, adaptive control, feedback systems, and intelligent/automated control architectures.
13. Power electronics, embedded power management, low‑power electronics, energy‑efficient system design for smart systems.
14. Wireless sensor data processing, edge computing, distributed systems, and networked intelligent system design.
15. Security, reliability, fault‑tolerance, and safety in intelligent electronic and communication systems.
First issue, Vol. 1, No. 1 (January–June 2026), will be published in April 2026.
The Article Processing Charge (APC) is waived for submissions until 31 May 2026.
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